英特爾(Intel)總裁暨執(zhí)行長歐德寧(Paul Otellini)表示，全球領(lǐng)導(dǎo)級(jí)晶圓代工廠恐怕將在接下來幾年因產(chǎn)能過剩而陷入危機(jī)。 歐德寧在一場日前(2月17日)于英國舉行的分析師會(huì)議上指出，晶圓代工市場的過剩產(chǎn)能，主要來自于意圖爭奪全球市占率的晶圓代工新秀 Globalfoundries 。但在隔天(2月18日)，他也宣布英特爾將在美國亞利桑那州興建一座晶圓廠，并在2011年為美國本地創(chuàng)造4,000個(gè)工作機(jī)會(huì)。 不過歐德寧對晶圓代工產(chǎn)能過剩的看法，與某些分析師意見并不相同，例如Future Horizons創(chuàng)辦人Malcolm Penn就表示，半導(dǎo)體產(chǎn)業(yè)應(yīng)該是進(jìn)入晶圓產(chǎn)能吃緊的時(shí)期，因?yàn)闊o論是IDM業(yè)者或是晶圓代工廠，在過去幾年都吝于投資制造產(chǎn)能。 歐德寧認(rèn)為：“晶圓代工廠并不是靠先進(jìn)制程賺錢，而是靠制造生命周期較長產(chǎn)品的二線制程。”他指出，先進(jìn)制程產(chǎn)能因 Globalfoundries 的大舉擴(kuò)張而過剩，意味著代工價(jià)格將下滑；一旦先進(jìn)制程代工價(jià)格下滑、二線制程也會(huì)跟著降，對整體業(yè)務(wù)造成威脅。 所以他預(yù)測在接下來幾年，臺(tái)積電與Globalfoundries等晶圓代工業(yè)者會(huì)開始遇到麻煩；至于三星(Samsung)則是因?yàn)槠鋬?nèi)存與邏輯業(yè)務(wù)而有不同的狀況。他并強(qiáng)調(diào)，芯片業(yè)務(wù)完全是靠產(chǎn)品開發(fā)與制造的效率，英特爾在這方面是首屈一指。 歐德寧表示：“我們的競爭對手必須對臺(tái)積電與Globalfoundries所提供的服務(wù)照單全收；”這也就是說，英特爾偏好能夠掌控制造領(lǐng)域的選項(xiàng)。但如果晶圓代工價(jià)格確實(shí)如他所預(yù)測地下跌，無晶圓廠業(yè)者如Broadcom與Qualcomm等其實(shí)獲利會(huì)更大，也能取得更多與英特爾競爭的優(yōu)勢。 編譯： Judith Cheng 本文授權(quán)編譯自EE Times，版權(quán)所有，謝絕轉(zhuǎn)載！ (參考原文： Intel: Foundry business is in oversuppy trouble, by Peter Clarke)

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{pagination} Intel: Foundry business is in oversuppy trouble Peter Clarke 2/18/2011 4:22 PM EST LONDON – The world's leading foundries are facing difficult times due to the creation of too manufacturing capacity, according to Paul Otellini, president and CEO of Intel Corp., the world's leading chip maker. "I think the foundry business is in big trouble over the next few years," Otellini told analysts at a conference here Thursday (Feb. 17) and accessed by EE Times by a telephone replay. He put it down to "significant overcapacity" mainly due to attempts to grab market share by new player Globalfoundries Inc. (Sunnyvale, Calif.). On Friday in Hillsboro, Oregon, Otellini said Intel would build a wafer fab in Arizona and create 4,000 U.S. jobs in 2011. However, talk of overcapacity does not chime with the view of some analysts, such as Malcolm Penn, founder of Future Horizons (Sevenoaks, England). Penn has heralded the coming of a fab-tight era, due to a lack of spending on manufacturing capacity by both IDMs and foundries over the last couple of years. Some have said that the chip world is rapidly collapsing to a handful of leading-edge chip makers most of whom will have some foundry interest. Intel and Samsung still make the majority of chips for sale under their own brand while Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) and Globalfoundries are pure-play foundries. Nonetheless Otellini does not seem eager to be joining the foundry crowd any time soon. "Foundries make money not on the leading edge but on the trailing edge, with long running products," he said. "Leading-edge capacity excess, driven by Globalfoundries' expansion primarily, means pricing is going to come down. As leading-edge pricing comes down, so does the trailing-edge [pricing], hollowing out the business. That means real trouble for Globalfoundries and TSMC over the next few years," Otellini predicted. He conceded that with its memory and logic operations Samsung was a different case. Otellini said chip building was all about the efficiency of the development and manufacturing operations and that Intel's was second to none. "Our competitors have to take what TSMC and Globalfoundries offer them," indicating that Intel liked having control of its manufacturing choices. But Otellini also glided over the collorary of his prediction of price erosion at the foundries; that fabless chip companies will be getting good deals on both leading- and trailing-edge silicon making those companies, the likes of Qualcomm and Broadcom, better able to compete with Intel. Nonetheless, Otellini's conclusion was that Intel and Samsung would increasingly pull away from the manufacturing pack, particularly Globalfoundries and TSMC.