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深圳市江波龍電子股份有限公司
QLC eMMC：一馬當(dāng)先，率先推出QLC eMMC，搭配江波龍自研主控芯片WM6000，先進(jìn)制程，更高密度，性能穩(wěn)定，為大容量手機(jī)市場加持。xSSesmc
閃存介質(zhì)：3D QLCxSSesmc
接口：eMMC 5.1xSSesmc
容量：128GB / 256GB / 512GBxSSesmc
順序讀寫速度：Up to 340MB/s / 300MB/sxSSesmc
產(chǎn)品應(yīng)用：智能手機(jī)xSSesmc
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ePOP4x：集成了eMMC和LPDDR的復(fù)合產(chǎn)品，為穿戴式設(shè)備量身定做。對比eMCP產(chǎn)品厚度更薄、尺寸更小。xSSesmc
協(xié)議：eMMC 5.1 + LPDDR4xxSSesmc
容量：32GB+16Gb / 64GB+16Gb xSSesmc
DRAM頻率：2133MHzxSSesmc
球數(shù)：144ballxSSesmc
尺寸：8*9.5*0.8 mmxSSesmc
工作溫度：25-℃~85℃xSSesmc
工作電壓：DRAM: VDD1=1.8V,VDD2=1.1V,VDDQ=0.6V;xSSesmc
eMMC: VCC : 2.7~3.6V, VCCQ: 1.7~1.95V/2.7~3.6VxSSesmc
產(chǎn)品應(yīng)用：智能手表xSSesmc
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