英特爾14nm Broadwell處理器最初計(jì)劃2013年底發(fā)布，但因?yàn)楦鞣N原因一再跳票，如今即使在2014年內(nèi)也只會(huì)有一小批產(chǎn)品面世，絕大部分都得等到2015年。
不過在另一方面，14nm工藝的代工生意倒是越發(fā)紅火了。早在去年初，新工藝尚未投產(chǎn)的時(shí)候，英特爾就已經(jīng)與半導(dǎo)體企業(yè)Altera達(dá)成合作，為其生產(chǎn)14nm Tri-Gate工藝芯片。其他客戶包括Achronix、Microsemi、Netronome、Tablula。
近日，英特爾又拿下了一個(gè)更重量級(jí)的客戶：
松下公司琵琶別抱，改簽英特爾為芯片供應(yīng)商，英特爾將向松下的系統(tǒng)LSI業(yè)務(wù)部門提供最新14nm制程芯片，這一下無疑再次踩了臺(tái)積電的地盤。
博( )報(bào)導(dǎo)，隨半導(dǎo)體研發(fā)成本上漲、晶圓外包代工風(fēng)氣盛行，其中尤以臺(tái)灣的臺(tái)積電表現(xiàn)最為亮眼。因此，英特爾首席執(zhí)行官Brian Krzanich自2013年上任以來，便積極改弦易轍，大力爭(zhēng)取來自其他行業(yè)、甚至是競(jìng)爭(zhēng)對(duì)手的外包訂單，以減緩個(gè)人電腦(PC)業(yè)務(wù)成長趨緩對(duì)芯片部門的業(yè)績沖激。目前，代工制造業(yè)務(wù)對(duì)英特爾總營收的貢獻(xiàn)甚微。
而此番成功取得松下的芯片供應(yīng)合約，則可說是英特爾搶攻晶圓代工市場(chǎng)的一大勝利。松下將成為英特爾最大制造業(yè)客戶，由英特爾負(fù)責(zé)設(shè)計(jì)及安置在松下影音產(chǎn)品內(nèi)的特殊芯片。
相比其他代工商，英特爾使用其尖端制造工藝生產(chǎn)的芯片將為松下設(shè)備帶去性能和功耗上的優(yōu)勢(shì)。
本文授權(quán)編譯自EE Times，版權(quán)所有，謝絕轉(zhuǎn)載
參考英文原文：Panasonic to Make 14nm SoCs at Intel，by Rick Merritt
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Panasonic to Make 14nm SoCs at Intel
Rick Merritt
SAN FRANCISCO — Panasonic will make SoCs in a low-power flavor of Intel's 14nm process technology. The Japanese company is the sixth announced customer for a foundry business that Intel says is strategic and expanding its packaging capabilities.
"We are doing extremely well getting customers who can use our technology," Sunit Rikhi, general manager of Intel's foundry group, said in a talk at Semicon West, though he would not provide details. "We are in this business to grow, and it's strategically an important vector in our Intel strategy."
Other companies making or planning to make chips in Intel's fabs include Achronix, Altera, Microsemi, Netronome, and Tablula. Rikhi described Intel's foundry business in broad terms: "We need to demonstrate our service orientation and earn trust of customers."
He suggested that the low-power variant of Intel's 14nm process is relatively new. Intel uses a general-purpose 22nm process but supports multiple flavors of its 32nm process.
Yoshifumi Okamoto, director of Panasonic's SoC group, said in a press release, "We will deliver highly improved performance and power advantages with next-generation SoCs by leveraging Intel's 14nm Tri-Gate process technology through our collaboration."
When asked about chip stacks, Rikhi said Intel is offering several options and plans to start work with outside packaging companies soon. "So far we have offered integrated packaging in-house, but we are beginning to talk to some customers about their buying wafers from us and having packaging done by OSATs. I would expect we will do that before too long."
Intel expects to make 10nm chips without extreme ultraviolet (EUV) lithography, he said, reiterating comments from Intel's Mark Bohr. However, Rikhi expressed enthusiasm for getting access to next-generation scanners and larger wafers as soon as possible. "EUV is like 450mm wafers. When it comes, it is great."
責(zé)編：Quentin
