英特爾(Intel)的發(fā)言人透露，該公司第一座18吋(450mm)晶圓廠計劃自2013年1月起「順利展開」，該座代號為D1X第二期( module 2)的晶圓廠已經(jīng)低調(diào)動土。 據(jù)了解，英特爾打算將D1X 第二期作為量產(chǎn)18吋晶圓IC的研發(fā)晶圓廠；該公司在2012年12月就透露正準(zhǔn)備擴(kuò)充D1X廠區(qū)，以「容納新的制造技術(shù)」，但該信息僅低調(diào)地在美國奧勒岡州當(dāng)?shù)孛襟w曝光，并沒有公布在公司官網(wǎng)。 英特爾D1X廠的第一期工程預(yù)期會是該公司第一條以12吋晶圓生產(chǎn)14奈米FinFET芯片的生產(chǎn)線；而英特爾在2012年10月時曾表示，將在2013年展開D1X第二期工程建設(shè)，預(yù)計兩年完工，2015年裝機、2016年開始生產(chǎn)。 D1X第二期廠房也可能與現(xiàn)有的D1X有所連結(jié)，包括無塵室的連線；根據(jù)英特爾發(fā)言人表示，該廠房取得必要的許可之后已經(jīng)在1月動工，造價約20億美元(不包括設(shè)備)，但該廠的運轉(zhuǎn)時程表尚未定案。 英特爾發(fā)言人表示：「我們還未公布該廠的上線時程，因為還未決定何時將展開18吋晶圓生產(chǎn)，以及將采用的制程節(jié)點?！?晶圓代工業(yè)者臺積電(TSMC)也透露過18吋晶圓制造發(fā)展計劃，該公司在2012年6月表示，將在2014年初在臺灣中部興建一座18吋晶圓廠，包括設(shè)備在內(nèi)的總成本約80億美元，待2019年開始運轉(zhuǎn)，預(yù)期每月可創(chuàng)造67億美元營收。 臺積電在2011年亦曾表示，計劃在現(xiàn)有晶圓廠──包括新竹的Fab12與臺中的Fab15──裝設(shè)18吋晶圓試產(chǎn)線。 編譯：Judith Cheng 參考原文： Construction of 450mm Fab 'Well Underway'，by Peter Clarke {pagination} The construction of Intel's first wafer fab for processing 450mm diameter wafers is "well underway," having started in January 2013, an Intel spokesperson tells EE Times. The fab -- known as D1X module 2 -- is intended to be a development fab for production of ICs on 450mm diameter wafers. However, the breaking of ground for the wafer fab was not widely reported at the time it occurred. Intel did announce in October 2012 that it was seeking permission to expand D1X with a second module, to accommodate "new manufacturing technology," but it only distributed the press release to local Oregon press and did not post the news on its website. The first D1X module is expected to be the first wafer fab to produce 14nm FinFET chips for Intel on 300mm diameter wafers. Back in October 2012 Intel said construction of D1X module 2 would begin in 2013 and take more than two years to complete, with wafer manufacturing equipment installation expected to begin in 2015, which would put first wafers out in 2016. D1X module 2 is also expected to be connected to the existing D1X with the likelihood that this will include a link between clean rooms. Construction of D1X module 2 began in January 2013 after the necessary permissions were obtained, according to an Intel spokesperson. The fab is expected to cost $2 billion, not including equipment, but there is no schedule for when the fab will start, the spokesperson added. "We have not said when it will come online because we have not said when we expect to have 450mm wafer production. Nor have we forecast a process node for 450mm," the spokesperson said in email to EE Times. Intel rival foundry Taiwan Semiconductor Manufacturing Co. Ltd. is the only other company with any sort of development push on 450mm production. Back in June 2012 it was reported that the Taiwanese government had approved a proposal to build a 450mm wafer fab in central Taiwan early in 2014. The total cost, including equipment, was expected to be about $8 billion, but the fab was predicted to be capable of producing wafers with a value of about $6.7 billion per year in 2019. TSMC said back in 2011 that it planned to install 450mm pilot lines within a couple of established wafer fabs -- Fab 12 in Hsinchu and Fab 15 in Taichung, Taiwan.

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