臺積電公司(TSMC)據(jù)傳將在今年三月投產(chǎn)采用20納米 CMOS 制程的蘋果 A7 處理器，預(yù)計今年夏天即可開始試產(chǎn)芯片，以期在2014年初實現(xiàn)量產(chǎn)。 根據(jù)媒體報導(dǎo)，臺積電得以如期在今年第一季完成設(shè)計的話，接下來將在今年五、六用間展開所謂的‘風(fēng)險生產(chǎn)’，并在2014年第一季開始商用化量產(chǎn)，如果一切順利的話，就能使該芯片用于下世代的 iPhone 和 iPad 中。臺積電正為其 用于制造 A7 處理器的 Fab-14 超大晶圓廠(Gigafab)提升制造產(chǎn)能。 臺積電的 Fab-14 位于臺南，它不僅是臺積電第一座可量產(chǎn)20nm CMOS 系統(tǒng)芯片的的晶圓廠，同時也將成為接下來 16nm FinFET 組件制程的所在地。 臺積電將為蘋果生產(chǎn) A7 處理器并不是什么新聞了。我們先前已有所耳聞，由于蘋果與三星針對其手機設(shè)計的全球?qū)＠V訟不斷，蘋果公司準(zhǔn)備將2011以來完全交由三星一家供貨商代工的處理器轉(zhuǎn)單臺積電。 據(jù)稱蘋果公司與臺積電在2011年已經(jīng)合作嘗試采用28nm制程的 A6 應(yīng)用處理器，但由于當(dāng)時臺積電的技術(shù)未到位，特別是有關(guān)附屬IP的問題而限制了雙方的合作。此外，傳言還提到英特爾(Intel)也可能為蘋果 A7 進行制造的可能性。英特爾已經(jīng)為蘋果公司的 MacBook 計算機提供 x86 處理器了，同時也逐步地增加為其代工服務(wù)。 然而，盡管英特爾十分精通于制造先進的微處理器，為第三方提供設(shè)計其自有處理器所需的 IP 以及為其進行制造，它可能會是一種高度復(fù)雜的設(shè)計互動，但對于英特爾目前的代工業(yè)務(wù)而言，它也可能會是一項優(yōu)勢。盡管如此，蘋果仍然可能采用多家供貨商為其制造處理器的策略，而且，它似乎可能透過一連串的合作方式來實現(xiàn)。 盡管三星可能繼續(xù)以 32nm/28nm CMOS 制程為蘋果供應(yīng) A6 處理器一段時間，而臺積電則尋求在 20nm 制程成為代工伙伴；而且，顯然地，蘋果也表明了在與臺積電合作的 16nm FinFET 發(fā)展藍圖之外，已經(jīng)與英特爾針對 14nm 與10nm FinFET 展開合作。 本文授權(quán)編譯自EE Times，版權(quán)所有，謝絕轉(zhuǎn)載 編譯：Susan Hong 參考英文原文：Apple's A7 expected to tape-out in March，by Peter Clarke

相關(guān)閱讀：
• 低價iPhone投產(chǎn)將帶旺Q2半導(dǎo)體市場
• 棄用高通基帶芯片，三星與蘋果之平臺戰(zhàn)啟幕
• [拆拆看]硬件與上代相似，iPad 4是來打醬油的么？w98esmc

{pagination} Apple's A7 expected to tape out in March Peter Clarke Foundry Taiwan Semiconductor Manufacturing Co. Ltd. will finish the tape out of Apple's A7 processor in 20-nm CMOS in March in time for volume production in early 2014, according to a report from DigiTimes which referenced unnamed sources. Completing the design in 1Q13 will allow the chip, expected to be used in forthcoming generations of iPhone and iPad, to begin so-called "risk production" in May or June and lead to high volume production in 1Q14, the report said. TSMC is adding manufacturing capacity at its Fab-14 Gigafab where is plans to make the A7 processor, the report added. Fab-14 in Tainan, Taiwan is not only set to be TSMC's first fab to produce 20-nm CMOS system chips in volume but it also earmarked as the place where it will bring up its follow-on 16-nm FinFET manufacturing process. That TSMC is set to make the A7 processor for Apple is no surprise. We've heard such things before that did not come to pass. Talk of Apple moving its processor production away from sole supplier Samsung has been rife since at least 2011, with a particular piquancy as Apple and Samsung have engaged in legal battles around the world over their mobile devices. It is thought that Apple engaged with TSMC to try and get the A6 application processor out in 2011 on the 28-nm process node but that the difficulties of migrating design elements, particularly around such as issues as collateral IP may have thwarted the move. Talk also continues to swirl around the possibility that Intel could also be a manufacturer for Apple. Intel does supply x86 processors to Apple for use in its MacBook computers and is gradually increasing its foundry engagements. However, even though Intel is well-versed in making complex microprocessors, offering all the IP needed to let a third-party design their own processor and then make it is a highly complex design interaction and possibly one that would be a stretch for Intel's foundry operation right now. Or, at least, Apple might think so if it got its fingers burned at the 28-nm node. Nonetheless the possibility remains that Apple could be moving to a multiple supplier strategy for its own processors. However, it seems likely that will be implemented as serial engagements. In other words, while Samsung may go on supplying A6 processors made using 32-nm/28-nm CMOS to Apple for some time, TSMC looks set to be the incumbent at 20-nm but it may have been made clear to the foundry that Apple is already working with Intel aiming at the 14-nm and 10-nm FinFET as a potential alternative to TSMC's 16-nm FinFET roadmap.