日本大廠富士通(Fujitsu)與松下(Panasonic)已經(jīng)正式宣布，雙方原則上同意了將各自系統(tǒng)芯片業(yè)務(wù)合并為一家獨立無晶圓廠芯片公司的計劃；日本開發(fā)銀行(The Development Bank of Japan)已經(jīng)被要求為上述計劃提供投資與融資的協(xié)助，富士通與松下并表示，兩家公司正在針對最終協(xié)議以及新公司的成立時間點進行討論。 富士通與松下合并旗下系統(tǒng)芯片業(yè)務(wù)的舉動在業(yè)界早有傳言，而由于未來成立的新公司會是無晶圓廠經(jīng)營模式，恐怕兩家母公司部分業(yè)務(wù)的出售以及裁員將無法避免。根據(jù)富士通與松下說法，尚未命名的新公司將會獨立運作，專注于提供高性能運算芯片，鎖定包括服務(wù)器、高速網(wǎng)絡(luò)、視覺處理、影像辨識，或是移動、低功耗無線連結(jié)等應(yīng)用。 在此同時，富士通也宣布了大幅度的半導(dǎo)體業(yè)務(wù)重整計劃，可能包括許多業(yè)務(wù)部門的出售，以及恐怕有2,000名員工面臨丟飯碗危機。富士通最新一季財報顯示，該公司當(dāng)季凈損達(dá)790億日圓(約9億美元)，合并凈銷售額則為1兆482億日圓(約120億美元)。

富士通分享半導(dǎo)體業(yè)務(wù)組織重整計劃與新策略方向
Source：FujitsuXpNesmc

本文授權(quán)編譯自EE Times，版權(quán)所有，謝絕轉(zhuǎn)載 本文下一頁：半導(dǎo)體業(yè)務(wù)重組將影響約2,000員工職位

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{pagination} 在 2012年9月就有傳言指出富士通打算擺脫半導(dǎo)體業(yè)務(wù)，而最新的進展是該公司已經(jīng)正式宣布將與松下合并系統(tǒng)芯片業(yè)務(wù)部門、成立無晶圓廠芯片公司；至于富士通其它半導(dǎo)體業(yè)務(wù)將何去何從，就需要擬定策略性的解決方案。 例如富士通的微控制器與模擬組件業(yè)務(wù)未來命運就無法確定，該公司僅表示正以“各種可能性”來看待該業(yè)務(wù)；這種說法意味著有可能繼續(xù)投資，也可能尋求出售或是完全放棄。但富士通僅表示，該公司的目標(biāo)是為客戶提供穩(wěn)定的貨源，并繼續(xù)發(fā)展該業(yè)務(wù)。 富士通也表示打算出售該公司位于日本三重的12寸晶圓廠，并特別提及臺灣晶圓代工大廠臺積電(TSMC)是潛在買主；但事實上，臺積電在 2012年才拒絕了一樁來自瑞薩電子(Renesas Electronics)的晶圓廠出售提議。而富士通最近也宣布將其半導(dǎo)體封測生產(chǎn)線轉(zhuǎn)手給另一家公司J-Devices。 在 系統(tǒng)芯片部門與松下整合，以及出售12寸晶圓廠之后，富士通半導(dǎo)體業(yè)務(wù)就只剩下位于日本會津若松(Aizu-Wakamatus)的一座8寸、一座6寸晶圓廠，以及屬于子公司FSET (Fujitsu Semiconductor Technology)的8寸晶圓生產(chǎn)線。富士通表示，將“合理化”改善上述這幾座工廠的產(chǎn)能利用率；而該公司也表示，其半導(dǎo)體業(yè)務(wù)組織重整將影響約 2,000員工職位。 本文授權(quán)編譯自EE Times，版權(quán)所有，謝絕轉(zhuǎn)載 參考英文原文：Fujitsu, Panasonic to form fabless chip firm，F(xiàn)ujitsu chip business faces radical restructure， by Peter Clarke

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• 富士通半導(dǎo)體獲海思半導(dǎo)體策略ASIC合作伙伴榮譽
• 2012年，無晶圓廠業(yè)績增長再次超越IDM
• 2012年電子產(chǎn)業(yè)十大收并購案例XpNesmc

{pagination} Fujitsu, Panasonic to form fabless chip firm Peter Clarke LONDON – Japan's Fujitsu Ltd. and Panasonic Corp. have announced that they have agreed in principle to merge their system LSI businesses to create an independent fabless chip company. The Development Bank of Japan Inc. has been asked to assist with investment and financing of the plan and Fujitsu and Panasonic said they are in discussions to finalize a contract and timetable for the creation of the company. A radical step was expected from the companies (see Fujitsu, Panasonic reportedly close to merging chip units). However, by opting to go fabless in merger a number of business disposals and job losses are expected at the parent companies. The companies said the as yet unnamed company will be independent of Fujitsu and Panasonic and would focus on offering chips that address high performance computing such as chips for servers and high-speed networking, visual processing and image recognition, mobile and low-power wireless connectivity. In a joint-statement the two companies said that each of them owns advanced technology and intellectual property but that they overseas semiconductor manufacturers have risen in prominence in recent years. The statement added that by focusing on the design and marketing of chips under a fabless model Fujitsu and Panasonic aim to achieve growth in the chip business. Fujitsu chip business faces radical restructure Peter Clarke LONDON – Japan's Fujitsu Ltd. has announced a radical restructuring of its semiconductor business that is likely to include major disposals and put 2,000 employees at risk of losing their jobs. The announcement came as Fujitsu reported a net loss of 79.0 billion yen (about $900 million) on fiscal third-quarter consolidated net sales of 1,048.2 billion yen (about $12 billion). In September of 2012 Fujitsu was reportedly trying to get out of the semiconductor business (see Fujitsu said to want out of chip business). A key part of the latest announcement is the merger of its system LSI business with that of Panasonic Corp. in the creation of a fabless chip company (see Fujitsu, Panasonic to form fabless chip firm). However, that leaves numerous parts of Fujitsu's semiconductor business for which strategic solutions need to be found. The fate of the Fujitsu's microcontroller and analog device business is uncertain as the company announced it is looking at an "entire range of possibilities" for the business. Such language is usually taken to mean a range from continued investment through to a sale or even closure. Fujitsu said it aims to offer a stable supply to customers and develop the business. Fujitsu also said it is looking to sell its 300-mm wafer fab at Mie to a foundry. Fujitsu specifically mentions Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) as a potential purchaser despite the fact that the Taiwanese foundry rejected a similar wafer fab related offer from fellow Japanese strugglers Renesas Electronics Corp. in 2012 (see TSMC's Chang says no to buying Renesas fab). Fujitsu recently announced the transfer of assembly and test lines to J-Devices Corp. After the integration of the system LSI business with that of Panasonic and the disposal of the 300-mm wafer fab at Mie, Fujitsu Semiconductor will be left with a 200-mm wafer fab and a 150-mm wafer fab in Aizu-Wakamatus and the 200-mm line of Fujitsu Semiconductor Technology (FSET). Fujitsu said employees would be "rationalized" to improve capacity utilization at these facilities. Fujitsu added that as a result of the decision to restructure these operations, approximately 2,000 people in the semiconductor group would "come under the scope of rationalization."