英特爾(Intel)CEO歐德寧(Paul Otellini)近日在該公司 2012年第四季財報發(fā)布分析師電話會議上表示，該公司正在自家LTE調(diào)制解調(diào)器的開發(fā)上取得進展，但恐怕在 2014年以前還看不到整合LTE調(diào)制解調(diào)器與應(yīng)用處理器的方案問世。 歐德寧在該場會議上表示，英特爾已經(jīng)推出僅支持?jǐn)?shù)據(jù)(data-only mode)的LTE調(diào)制解調(diào)器芯片給客戶，而支持?jǐn)?shù)據(jù)與語音的多模調(diào)制解調(diào)器芯片預(yù)計在2013年內(nèi)推出。他補充指出，預(yù)計第一批采用英特爾LTE技術(shù)的手機將在 2014年初上市，時間點約是在世界移動通信大會(Mobile World Congress)期間。 由于缺乏整合基頻與處理器的手機應(yīng)用處理器產(chǎn)品，英特爾在通訊領(lǐng)域落后高通(Qualcomm)好一段距離，后者的驍龍(Snapdragon)系列處理器已經(jīng)可提供整合性的LTE技術(shù)支持。其它也整合了基頻調(diào)制解調(diào)器的應(yīng)用處理器產(chǎn)品，包括瑞薩(Renesas Mobile)的MP6530與意法愛立信(ST-Ericsson)采用28納米 FDI-SOI 制程的NovaThor L8580 ModAp芯片。 英特爾的無線技術(shù)大部分來自于該公司在 2011年初完成收購程序的英飛凌(Infineon Technologies)無線業(yè)務(wù)部門。歐德寧表示，前英飛凌團隊在LTE技術(shù)開發(fā)方面進展不錯：”我們認(rèn)為我們擁有非常具競爭力的解決方案；該團隊或 許以往并不是以第一個推出解決方案聞名，但是在產(chǎn)品的可靠性、成本效益與價格競爭力上表現(xiàn)非常好?！? 他補充指出，英特爾內(nèi)部擁有藍牙、Wi-Fi、GPS位置偵測與NFC等眾多技術(shù)，可滿足市場與時俱進的整合度需求。 本文授權(quán)編譯自EE Times，版權(quán)所有，謝絕轉(zhuǎn)載 編譯：Judith Cheng 參考英文原文：Intel says no LTE integration until 2014，by Peter Clarke

相關(guān)閱讀：
• 基于現(xiàn)場4G LTE網(wǎng)絡(luò)的多服務(wù)網(wǎng)關(guān)亮相CES2013
• 三年近兩億，4G LTE迅猛發(fā)展時面臨諸多挑戰(zhàn)
• 大環(huán)境惡劣，LTE基帶芯片廠商生存空間受擠壓Yl4esmc

{pagination} Intel says no LTE integration until 2014 Peter Clarke LONDON – Intel Corp. is making progress with its development of LTE modems but does not expect to have an integrated LTE modem and application processor until 2014, according to CEO Paul Otellini. When asked specifically about integration of LTE modem circuitry with a mobile application processor such as the Atom during an analysts' conference call held to discuss Intel's fourth quarter 2012 financial results, Otellini said: "In terms of integrated solutions, you'll see higher levels of integration from us next year." During the call, Otellini said Intel was shipping a data-only mode LTE modem IC to customers and that a data-and-voice multimode modem would ship during the course of 2013. He added that he expects the first mobile phones with Intel supplied LTE capability to have launched early in 2014 at about the time of the Mobile World Congress. The lack of an integrated baseband modem and processor for mobile applications puts Intel some way behind Qualcomm Inc. (San Diego), which already offers integrated LTE capability in its Snapdragon line of application processors. Other companies with chips that integrate the application processor with the baseband modem include Renesas Mobile with its MP6530 and ST-Ericsson NV with its NovaThor L8580 ModAp chip implemented in 28-nm fully-depleted silicon on insulator process technology. Intel's wireless capabilities are largely derived from the company’s acquisition of the wireless business unit of Infineon Technologies AG (Munich, Germany) completed in January 2013. Otellini said the former Infineon team is making good progress in LTE: "We believe we have a very competitive solution. The Infineon team is known for not necessarily being first to market, but being really good at engineering a very solid solution and being cost effective and cost competitive and I think that they are doing a very good job with respect to this product." He added that Intel has many of the technologies for Bluetooth, Wi-Fi, GPS location detection and near field communications in house and would offer levels of integration that make sense at the right time.