因應(yīng)歐美市場對于消費電子產(chǎn)品需求下滑，東芝公司(Toshiba Corp.)宣布計劃關(guān)閉3座半導(dǎo)體制造廠，將其分離式、模擬與影像IC的生產(chǎn)整并于其它3座半導(dǎo)體廠。同時，東芝并將在2012年1月以前為其部份半導(dǎo)體廠進(jìn)行減產(chǎn)，包括ASIC與MCU制造產(chǎn)線。 東芝公司表示，景氣趨緩對于歐美市場的PC與TV需求影響特別顯著。因此，東芝公司計劃在2012年上半年關(guān)閉位于日本北九州(Kitakyushu)和濱岡(Hamaoka)的光學(xué)組件晶圓廠，以及位于茂原(Mobara)的電源半導(dǎo)體組裝廠。 據(jù)東芝公司表示，在這幾處生產(chǎn)據(jù)點的員工原則上將改調(diào)任東芝集團的其它單位服務(wù)。但東芝公司并未透露約有多少正式員工與約聘人員將受此波閉廠影響。 此次組織重整將使東芝在日本國內(nèi)的6座生產(chǎn)據(jù)點整并成3大制造廠：姬路半導(dǎo)體(Hijimeji Operations Semiconductor；兵庫縣揖?？?；加賀東芝電子(Kaga Toshiba Electronics Corp.；石川縣能美)，以及豐前東芝電子(Buzen Toshiba Electronics Corporation；福崗縣豐前) 。 經(jīng)過重整后的Hijimeji Operations Semiconductor將成為東芝公司電源半導(dǎo)體與小型訊號組件的開發(fā)中心，Kaga Toshiba Electronics則將成為電源半導(dǎo)體前端制程的主要據(jù)點，并將增加200mm晶圓制造產(chǎn)能，以及擴展至包括光學(xué)半導(dǎo)體制造的產(chǎn)線。Buzen Toshiba將成為光學(xué)半導(dǎo)體組裝與封裝的開發(fā)中心，但也為特定產(chǎn)品進(jìn)行生產(chǎn)，其余產(chǎn)品的制造則改采外包方式，東芝表示。 這一波減產(chǎn)行動將影響到東芝的六座制造廠：生產(chǎn)模擬半導(dǎo)體與影像傳感器的大分工廠(Oita operations)；生產(chǎn)分離式半導(dǎo)體的Himeji Operations Semiconductor；生產(chǎn)光學(xué)組件的Kitakyushu Operations；生產(chǎn)ASIC與MCU的巖手東芝電子(Iwate Toshiba Electronics)；以及生產(chǎn)獨立式半導(dǎo)體組件的Kaga Toshiba Electronics與Hamaoka Toshiba electronics。 此外，東芝的幾座廠房將在明年初以前進(jìn)行減產(chǎn)。Oita operations將于今年年底前停工六天以及進(jìn)行減產(chǎn)措施。Himeji Operations Semiconductor與Kitakyushu Operations也將停工兩周。東芝表示將在2012年初重新評估市況及所需產(chǎn)能。 編譯：Susan Hong 本文授權(quán)編譯自EE Times，版權(quán)所有，謝絕轉(zhuǎn)載 參考英文原文：Toshiba to close wafer fabs, slow IC production，by Peter Clarke

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{pagination} Toshiba to close wafer fabs, slow IC production Peter Clarke LONDON – Toshiba Corp. has announced it plans to close three manufacturing facilities and consolidate much of its discrete, analog and imaging IC production into three others, as part of a response to a fall off in demand for consumer products from the western hemisphere. At the same time Toshiba said it would cut production at some of its semiconductor facilities, including one making ASICs and MCUs, from now until early January 2012. Toshiba said the slowdown was notably in demand for PCs and TVs in Europe and the United States. As a result, in the first half of its 2012 fiscal year Toshiba plans to close wafer fabs used for optical components in Kitakyushu and Hamaoka as well as an assembly plant used for power semiconductors at Mobara. The company added that regular employees at the affected facilities will, in principle, be redeployed within Toshiba Group. Toshiba did not disclose how many permanent and contract staff would be affected by the closures. The re-organization will concentrate manufacturing at three major facilities: Hijimeji Operations Semiconductor (Ibo-gun, Hyogo prefecture); Kaga Toshiba Electronics Corp. (Nomi, Ishikawa prefecture); and Buzen Toshiba Electronics Corporation (Buzen, Fukuoka prefecture). After the re-organization Hijimeji Operations Semiconductor will be a development center for power semiconductors and small signal devices, Toshiba said. Kaga Toshiba Electronics will be a main location for power semiconductor front-end process and will increase the 200-mm wafer manufacturing capacity of its 200-mm and expand production to include optical semiconductor manufacturing. Buzen Toshiba will become a development center for the assembly and packaging of optical semiconductors but with production limited to certain products while the rest is outsourced, Toshiba said. The production slow down will affect six facilities in all: Oita operations, which produces analog semiconductors and image sensors; Himeji Operations Semiconductor, which produces discrete semiconductors; and Kitakyushu Operations, which produces optical semiconductor devices; Iwate Toshiba Electronics, which produces ASICs and MCUs; and Kaga Toshiba Electronics and Hamaoka Toshiba electronics, which both produce discrete semiconductors. Oita will have a 6-day shutdown around the end of the year as well as running at reduced levels. Himeji and Kitakyushu would both be put on a two-week shutdown, Toshiba said. Toshiba said it would re-assess required production levels early in 2012.