蘋果的下一代手機(jī)iPhone5會(huì)給我們帶來什么驚喜？
可能運(yùn)行快一點(diǎn)？搭配一個(gè)稍微大一點(diǎn)、更高分辨率的顯示屏幕和攝像頭？采用更快的（HSDPA+）網(wǎng)絡(luò)鏈接？但這些升級(jí)的內(nèi)容，不足以配的上iPhone5這個(gè)名字。不過為了對(duì)得起Apple做的努力，我們姑且可以給這部手機(jī)起個(gè)名字叫iPhone 4+。
另一方面，從報(bào)告看來，對(duì)于那些已經(jīng)用到iPad2設(shè)計(jì)里的芯片，有希望在下一代iPhone上進(jìn)行產(chǎn)品升級(jí)。
競爭最激烈的還是基帶處理器，從現(xiàn)在的情況看，蘋果會(huì)在3G版手機(jī)使用英飛凌芯片，而CDMA版本則繼續(xù)使用高通的MDM6600。
UBM TechInsights的高級(jí)技術(shù)分析師史蒂夫說，在3G方面，蘋果公司可能會(huì)升級(jí)到英飛凌X-GOLD 626或706，以便支持HSDPA+網(wǎng)絡(luò)。
點(diǎn)擊這里進(jìn)入EE Times，閱讀保密版完整的故事。
編譯：
Luffy Liu
本文授權(quán)編譯自EE Times，版權(quán)所有，謝絕轉(zhuǎn)載
參考英文原文：Next iPhone looks to be an underachiever，by Rick Merritt
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Next iPhone looks to be an underachiever
Rick Merritt
Apple Inc.’s next-generation handset is likely to run a bit faster; sport a somewhat larger, higher-resolution display and camera; and link to faster (HSDPA+) networks. But the incremental upgrade will not merit the name iPhone 5. We give the handset a C for effort and dub it the iPhone 4+.
On the other hand, the accompanying report card looks bright for the chip vendors already designed into the iPad 2; most have a better-than-average shot of getting sockets in the evolutionary smartphone.
The most heated competition will be over baseband processors, where the likely scenario sees Apple continuing to use its tried-and-true Infineon chips for 3G phones and the Qualcomm MDM6600 for the CDMA versions.
On the 3G side, Apple may upgrade to Infineon’s X-Gold 626 or 706 to pick up support for HSDPA+ networks, says Steve Bitton, senior technology analyst at our partner UBM TechInsights.
Click here to read the full story at EE Times Confidential.
責(zé)編：Quentin
