據臺灣經濟新聞報道，盡管目前全球經濟形勢一片慘淡，臺灣半導體行業(yè)供應鏈在2011年下半年仍然被寄予厚望。這一切都將歸功于新一代蘋果產品的需求推動。
該報告稱，預計蘋果即將推出的產品包括了新一代MacBook Air，iPhone4S和iPad3，并將在8月份開始采購芯片。
但是臺積電（Taiwan Semiconductor Manufacturing Co. Ltd）和聯(lián)華（United Microelectronics Corp.），以及其他一些臺灣半導體封裝公司，均不約而同地預計第三季度晶圓增長會下降。
根據一份行業(yè)觀察家的報告，蘋果早已經完成了新產品的技術規(guī)格書、芯片列表和一系列驗證流程，并已給供應商下訂單。這可能是臺灣半導體產業(yè)在第三和第四季度打翻身仗的關鍵所在。
報告還稱，高通是蘋果手機IC的主要供應商，臺積電和日月光（Advanced Semiconductor Engineering Inc）都很有希望在八月或九月拿到他們的IC代工訂單。
在報告中列出其他有可能受益的廠商和產品包括：頎邦科技（Chipbond Technology Inc.），Ardentek，瑞薩（Renesas）和德州儀器（TI）。
以及瑞昱半導體（Realtek Semiconductor Corp.）的以太網芯片，旺宏（Macronix International）用于BIOS的NOR flash，創(chuàng)惟(Genesys)的讀卡器芯片和立锜科技（Richtek Technology）的電源管理芯片。
編譯：
Luffy Liu
本文授權編譯自EE Times，版權所有，謝絕轉載
參考英文原文：Taiwan comforted by Apple chip spend cycle，by Peter Clarke
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Taiwan comforted by Apple chip spend cycle
Peter Clarke
LONDON – Despite concern about the global economic situation Taiwan is taking comfort from an expected cycle of semiconductor purchasing to come in the second half of 2011, driven by the needs of forthcoming Apple products, according to a Taiwan Economic News report.
Apple is expected to start buying chips for upcoming products including the Macbook Air, iPhone 4S and iPad 3, in August, the report said.
Foundries Taiwan Semiconductor Manufacturing Co. Ltd. and United Microelectronics Corp. as well as packaging companies in Taiwan have reduced estimates of wafer growth in the third quarter.
However, Apple has completed the technical specifications, chip lists and certification processes for a number of its products and placed orders with suppliers, according to the report, which cited industry observers as sources. This is likely to benefit the Taiwan semiconductor industry in the third and fourth quarters.
Qualcomm is the major supplier of handset ICs for Apple and Qualcomm is expected to place orders with TSMC and packaging firm Advanced Semiconductor Engineering Inc. in August or September the report said.
Other likely beneficiaries listed in the report are likely to be Chipbond Technology Inc. and Ardentek Corp. performing packaging for Renesas and Texas Instruments, Realtek Semiconductor Corp. for Ethernet chips, Macronix International for NOR flash memory for BIOS, Skyworth Group for memory card reader chips and Richtek Technology for power management chips.
責編：Quentin
